Modeling the process of cutting traces on semiconductor wafers under removal them by the method of chemical-mechanical non-contact polishing

V. Lashkaryov Institute of Semiconductor Physics of National Academy of Sciences of Ukraine

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A.V. Fomin, G.A. Paschenko, M.Yu. Kravetscy // Semiconductor Physics, Quantum Electronics & Optoelectronics, V.18, №3, P.186-189, (2015)

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