V.E. Lashkaryov Institute of Semiconductor Physics NAS of Ukraine
National Academy of Sciences of Ukraine


Sub-THz active assembly with mechanical scanning for security systems


Inspection of content in packages that are transparent in sub-terahertz spectral range (paper, plastic, polyfoam, gypsum plasterboard, unhumid wood, footwear sole, knapsacks, etc.)

Main technical specifications :

  • active mode (with using a radiation source)
  • operation frequency 70+-15, 140+-3, 280+-10 GHz
  • doesn't need additional cooling
  • scanning speed 2 min.
  • image format 60х>=40 pixels
  • operating region 60х>=40 mm<sup>2</sup> (can be extended)
  • dynamic range >=40 dB


Fig. 1. General view of assembly and its parts (click to view full-size).

Fig. 2. Dielectric objects at 275 GHz hidden inside a hollowing polyfoam package (not seen for detection in X-Ray, visible and IR spectra) (click to view full-size).


Contacts: Ukraine, V.E. Lashkaryov Institute of Semiconductor Physics NAS of Ukraine, This email address is being protected from spambots. You need JavaScript enabled to view it.